RESIN COMPOSITION, INSULATING SHEET WITH BASE, PREPREG, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE

摘要

Disclosed is a resin composition which enables to produce a multilayer printed wiring board having high heat resistance and low thermal expansion property. When this resin composition is used for an insulating layer of a multilayer printed wiring board, separation or cracking does not occur in a thermal impact test such as a cooling/heating cycle test. Also disclosed are an insulating sheet with base, a prepreg, a multilayer printed wiring board and a semiconductor device, each using such a resin composition. Specifically disclosed is a resin composition which is used for forming an insulating layer of multilayer printed wiring boards. This resin composition is characterized in that the surface roughness parameter Rvk of an insulating layer made from the resin composition and subjected to a roughening treatment is not less than 0.1 mum but not more than 0.8 mum.