发明名称 RESIN SEALING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a resin sealing device allowing facilitation or elimination of adjustment work of contact of molds by clamping the molds without deforming it even if a toggle link type press mechanism is used. SOLUTION: The resin sealing apparatus keeps upper and a lower molds 112 and 122 supported by platens so that the molds are vertically opened or closed by the toggle link type press mechanism 106 through the platens. A lead frame 150 is clamped by the upper and lower molds 112 and 122 and sealed with a resin. A horizontal supporting region is formed when the lower mold 122 is supported by a movable platen 104. The supporting region is smaller than a width between both horizontal ends of the lead frame 150 when the maximum clampable lead frame 150 is placed. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009148933(A) 申请公布日期 2009.07.09
申请号 JP20070327347 申请日期 2007.12.19
申请人 SUMITOMO HEAVY IND LTD 发明人 KISHI YUICHI;OGUMA KEN
分类号 B29C33/22;B29L31/34;H01L21/56 主分类号 B29C33/22
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