| 摘要 |
PROBLEM TO BE SOLVED: To allow quick and accurate gripping with a conveying mechanism by enabling lifting while keeping a lead frame in a predetermined horizontal position after resin sealing. SOLUTION: A resin sealing mold 100 is used for clamping the lead frame 150 mounted with a semiconductor chip 152 so that a part of the lead frame 150 is sealed with a resin 160. The resin sealing mold 100 comprises eject pins 120, 122 and 126 for releasing the lead frame 150 from a mold surface after resin sealing, and a lead frame positioning pin 124 for determining a horizontal position of the lead frame 150 to the mold. When releasing, the lead frame positioning pin 124 is projected (moved) in the same projecting (moving) direction as the eject pins 120, 122 and 126 by cooperating with the pins 120, 122 and 126. COPYRIGHT: (C)2009,JPO&INPIT |
