COPPER FOIL WITH FILLER PARTICLE-CONTAINING RESIN LAYER AND COPPER-CLAD LAMINATE USING FILLER PARTICLE-CONTAINING RESIN LAYER

摘要

PROBLEM TO BE SOLVED: To provide a copper foil with a filler particle-containing resin layer which exhibits superb adhesiveness between the copper foil and the cured filler particle-containing resin layer when a copper-clad laminate is manufactured using the copper foil. SOLUTION: In this copper foil with a filler particle-containing resin layer for a printed wiring board having the filler particle-containing resin layer formed on one side of the copper foil, the filler particle-containing resin layer contains an aromatic polyamide resin, an epoxy resin and an appropriate amount of curing promotor. Further, the copper foil with a filler particle-containing resin layer is characterized in that the resin layer is a semi-cured resin layer containing a filler particle treated by an aminosilane coupling agent, and the preferable range of the filler particle content of the fill particle-containing resin layer is 2.0 to 18.0 vol%. COPYRIGHT: (C)2009,JPO&INPIT