| 摘要 |
PROBLEM TO BE SOLVED: To predict the occurrence of an earthquake to minimize damage by preventing an object to be processed from flying out of an opened container. SOLUTION: A semiconductor manufacturing apparatus includes: a transfer area Sa including a transfer mechanism 13 for a container 3; an elevating mechanism 18 disposed in a working area Sb below a heat treatment furnace 5, and configured to support a holder 4 mounting a plurality of the objects to be processed on a lid member 17 and to load and unload the holder into and out of the heat treatment furnace; a door mechanism 15 configured to open and close an opening of a partition wall 6 separating the transfer area Sa from the working area Sb together with a lid of the container of a transfer part; a reception part 28 receiving emergency earthquake information based on preliminary tremor distributed through a communication line 26 or a preliminary tremor detection part directly detecting preliminary tremor; and a control part 29 carrying out a first step in which an operation of a semiconductor manufacturing apparatus 1 is stopped based on the received emergency earthquake information or the detected preliminary tremor, and a second step in which, when the door mechanism 15 is in an opened state, the door mechanism 15 is closed. COPYRIGHT: (C)2009,JPO&INPIT
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