| 摘要 |
PROBLEM TO BE SOLVED: To provide a pattern plating film which covers a pattern of a conductor made from aluminum or copper formed on a printed circuit board or a wafer, and to provide a method for forming the pattern plating film. SOLUTION: The pattern plating film 9 is formed on the pattern 3 of the conductor made from copper or aluminum formed on the printed circuit board or the wafer 1, and comprises an electroless-plated film 5 of nickel and an electroless-plated film 7 of a gold-palladium alloy, which have been sequentially formed on the pattern 3 of the conductor. The thickness of the plated film of nickel is preferably 1 to 20μm, and the thickness of the plated film of the gold-palladium alloy is preferably 0.01μm or more. For the plating of the gold-palladium alloy, an electroless plating solution of the gold-palladium alloy is used, which includes a soluble aurate, a soluble palladium salt, a water-soluble amine salt, a carboxylate and a reducing agent. COPYRIGHT: (C)2009,JPO&INPIT
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