发明名称 Methods and Devices for Wireless Chip-to-Chip Communications
摘要 Wireless chip-to-chip communications are methods and devices are disclosed. In an example, a wireless chip-to-chip communication device includes a plurality of chips, each of the plurality of chips having at least one antenna and formed on a multi-layered structure. The multi-layered structure includes first and second absorption layers. The first and second absorption layers are configured to enclose a propagation medium having a given dielectric constant. The plurality of chips are configured to wirelessly communicate with each other via the respective antennas in accordance with a given wireless communication protocol via a direct propagation path within the propagation medium.
申请公布号 US2009175323(A1) 申请公布日期 2009.07.09
申请号 US20080970549 申请日期 2008.01.08
申请人 QUALCOMM INCORPORATED 发明人 CHUNG WOO CHEOL
分类号 H04B1/38 主分类号 H04B1/38
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