| 摘要 |
<P>PROBLEM TO BE SOLVED: To materialize a device for manufacturing a semiconductor device, which can effectively suppress the generation of voids in a resin layer. <P>SOLUTION: In the device for manufacturing the semiconductor device, especially when filling of an underfill material resin composition layer 3 is implemented using a membranous film, the pressing tool head 6 of a flip chip bonder forming the semiconductor manufacturing device is divided into a plurality of regions. Since those regions can be pressed with the sequences such as pressure, pressing timing, made mutually independent, the occurrence of voids can be substantially suppressed. <P>COPYRIGHT: (C)2009,JPO&INPIT |
