发明名称 METAL-CLAD POLYETHYLENE NAPHTHALATE SUBSTRATE AND METHOD FOR MANUFACTURING IT
摘要 PROBLEM TO BE SOLVED: To provide a metal-clad polyethylene naphthalate substrate having such high adhesive forces as an initial adhesive force between a metal layer consisting of a ground metal layer and a copper-clad layer overlying the ground metal layer, and a film, and a heat-resistant adhesive force, and if necessary, capable of thinning down the whole substrate including the thickness of the film, and to provide a method for manufacturing efficiently it. SOLUTION: The metal-clad polyethylene naphthalate substrate having the metal layer on the surface of at least one side of a polyethylene naphthalate film, is characterized by satisfying the following requirements (1) and (2). (1) The surface with which the ground metal layer of the polyethylene naphthalate film is brought into contact has a mean roughness (Ra) at the central line of 0.5-4 nm. (2) The ground metal layer comprises a nickel alloy containing at least one kind of metal selected from a group consisting of chromium, vanadium, titanium and molybdenum formed by a dry plating method as a main component, and its thickness is 3-50 nm. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009148995(A) 申请公布日期 2009.07.09
申请号 JP20070329581 申请日期 2007.12.21
申请人 SUMITOMO METAL MINING CO LTD 发明人 NAGATA JUNICHI;OGASAWARA SHUICHI
分类号 B32B15/09;C23C14/02;C23C14/14;H05K1/03;H05K1/09;H05K3/38 主分类号 B32B15/09
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