发明名称 |
METHODS OF CONFIGURING A PROXIMITY HEAD THAT PROVIDES UNIFORM FLUID FLOW RELATIVE TO A WAFER |
摘要 |
<p>Methods configure a proximity head for conditioning fluid flow relative to a proximity head in processing of a surface of a wafer by a meniscus. The methods configure the head in one piece while maintaining head rigidity even as the head is lengthened for cleaning of large diameter wafers. The one-piece head configuring separates main fluid flows from separate flows of fluid relative to the wafer surface, with the separation being by a high resistance fluid flow configuration, resulting in substantially uniform fluid flows across increased lengths of the head in a unit for either fluid supply or return.</p> |
申请公布号 |
WO2009085250(A2) |
申请公布日期 |
2009.07.09 |
申请号 |
WO2008US13985 |
申请日期 |
2008.12.19 |
申请人 |
LAM RESEARCH CORPORATION;KHOLODENKO, ARNOLD;LIN, CHENG-YU(SEAN) |
发明人 |
KHOLODENKO, ARNOLD;LIN, CHENG-YU(SEAN) |
分类号 |
H01L21/302;H01L21/30 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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