| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which has high radiation sensitivity, has such a development margin as to form a good pattern profile even in a development time exceeding the optimum time in a development step, enables to easily form a patterned thin film excellent in adhesion, and is suitable for forming an interlayer insulation film having high heat resistance, high solvent resistance, a high transmittance, a low dielectric constant and dry etching resistance. <P>SOLUTION: The radiation-sensitive resin composition comprises a copolymer of at least one component selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic acid anhydrides and another unsaturated compound different from the at least one component, a 1,2-quinonediazide compound, and a polymer containing ≥70 wt.% of a styrenic repeating unit. <P>COPYRIGHT: (C)2009,JPO&INPIT |
