发明名称 |
METHOD AND SYSTEM FOR FORMING AT LEAST ONE DIELECTRIC LAYER |
摘要 |
PROBLEM TO BE SOLVED: To provide a desired etched aspect ratio. SOLUTION: A method for forming a structure includes a step of forming at least one feature across a surface of a substrate. A nitrogen-containing dielectric layer is formed over the at least one feature. A first portion of the nitrogen-containing layer on at least one sidewall of the at least one feature is removed at a first rate and a second portion of the nitrogen-containing layer over the substrate adjacent to a bottom region of the at least one feature is removed at a second rate. The first rate is greater than the second rate. A dielectric layer is formed over the nitrogen-containing dielectric layer. COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009152550(A) |
申请公布日期 |
2009.07.09 |
申请号 |
JP20080271314 |
申请日期 |
2008.10.21 |
申请人 |
APPLIED MATERIALS INC |
发明人 |
XIA LI-QUN;BALSEANU MIHAELA;NGUYEN VICTOR;WITTY DEREK R;M'SAAD HICHEM;YANG HAICHUN;LU XINLIANG;KAO CHIEN-TEH;CHANG MEI |
分类号 |
H01L21/3065;C23C16/42;C23C16/505;H01L21/768;H01L23/522;H01L29/78 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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