发明名称 METHOD AND SYSTEM FOR FORMING AT LEAST ONE DIELECTRIC LAYER
摘要 PROBLEM TO BE SOLVED: To provide a desired etched aspect ratio. SOLUTION: A method for forming a structure includes a step of forming at least one feature across a surface of a substrate. A nitrogen-containing dielectric layer is formed over the at least one feature. A first portion of the nitrogen-containing layer on at least one sidewall of the at least one feature is removed at a first rate and a second portion of the nitrogen-containing layer over the substrate adjacent to a bottom region of the at least one feature is removed at a second rate. The first rate is greater than the second rate. A dielectric layer is formed over the nitrogen-containing dielectric layer. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009152550(A) 申请公布日期 2009.07.09
申请号 JP20080271314 申请日期 2008.10.21
申请人 APPLIED MATERIALS INC 发明人 XIA LI-QUN;BALSEANU MIHAELA;NGUYEN VICTOR;WITTY DEREK R;M'SAAD HICHEM;YANG HAICHUN;LU XINLIANG;KAO CHIEN-TEH;CHANG MEI
分类号 H01L21/3065;C23C16/42;C23C16/505;H01L21/768;H01L23/522;H01L29/78 主分类号 H01L21/3065
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