发明名称 HEAT DISSIPATING MECHANISM OF ELECTRONIC APPARATUS, AND AIR TRANSMISSION MEMBER
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a heat dissipating mechanism of an electronic apparatus, which can suppress the generation of noise while improving heat dissipation efficiency. <P>SOLUTION: The heat dissipating mechanism of the electronic apparatus has an inlet 110, an exhaust vent 130, and a fan 140, and discharges heat generated in a casing 100 to the outside of the casing. The heat dissipating mechanism further includes an air transmission member 150 having a first opening in communication with the discharge opening of the fan provided in the casing and a second opening in communication with the exhaust vent to transmit air in the casing which is discharged from the fan to the outside of the casing through the first opening and the second opening. A thin film 152, which permeates no air and permeates air vibration generated in a space in the air transmission member to a space outside the air transmission member, is provided on the wall surface of the air transmission member. Accordingly, since acoustic transmission characteristics of the space in the air transmission member varies by permeation (transmission) of air vibration due to the thin film, noise originated from a resonance phenomenon generated in the air transmission member and generated around the exhaust vent can be suppressed without causing deterioration of heat dissipation efficiency. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009152326(A) 申请公布日期 2009.07.09
申请号 JP20070328056 申请日期 2007.12.19
申请人 SONY CORP 发明人 SHIGEMASA MANABU
分类号 H05K7/20;H01L23/467 主分类号 H05K7/20
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