| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing, which provides a semiconductor apparatus having high reliability and has excellent moldability even without carrying out a postcure, and a method for producing a semiconductor apparatus using the epoxy resin composition. SOLUTION: The epoxy resin composition for sealing comprises an epoxy resin, a curing agent, a curing promoter and an inorganic filler. The composition contains an imidazole compound having a melting point of≥100°C, as a curing promoter, and has a weight reduction ratio due to the presence of a volatile component by heat treatment at 175°C of≤0.3%. COPYRIGHT: (C)2009,JPO&INPIT |
