SEMICONDUCTOR SUBSTRATE BONDING APPARATUS AND SEMICONDUCTOR SUBSTRATE BONDING METHOD

摘要

A semiconductor substrate bonding apparatus (1) is provided with a first substrate holding table (24) for holding a first semiconductor substrate (Wu); a second substrate holding table (36) for holding a second semiconductor substrate (Wd); a first driving mechanism (46) for tilting and turning the second substrate holding table (36) in one direction about the shaft; a second driving mechanism (48), which tilts and turns the second substrate holding table (36) in the other direction about the shaft; and a control apparatus (90) for controlling drive of the first and the second drive mechanisms (46, 48). When the two substrates abut to each other, the control apparatus (90) calculates components of one and the other forces operating from the second semiconductor substrate (Wd) to the second substrate holding table (36), and based on each force component, the first and the second driving mechanisms (46, 48) are repeatedly driven, and the two substrates are bonded to each other with high parallelism.