发明名称 WIRE BONDING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To maintain predetermined pressing force being pressing force to a bonding surface by a bonding tool from the start till the end of bonding. <P>SOLUTION: A wire bonding device comprises the bonding tool 20, a horn 30, a support arm 40, a support 50, a driving means 60 for pressing the bonding tool 20 against a workpiece W by tilting the support arm 40 at a portion coupled to the support 50, a leaf spring 70 displaced in accordance with driving force by the driving means 60, a position detecting means 82 for detecting a position detection body 80 on a free end side of the leaf spring 70, a pressing force calculating means (control unit 90) which calculates the pressing force of the bonding tool 20 on the basis of position information of the position detection body 80, and a driving force control means (control unit 90) for controlling the driving force of the driving means 60 on the basis of the calculated pressing force, and controls the driving force of the driving means 60 so as to maintain the pressing force of the bonding tool 20 at design pressing force. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009152480(A) 申请公布日期 2009.07.09
申请号 JP20070330700 申请日期 2007.12.21
申请人 SHINAPEX CO LTD 发明人 SATO KAZUHIRO
分类号 H01L21/60 主分类号 H01L21/60
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