| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser dicing apparatus that comprehends the generation of transpired melt substance during processing for a modified region formation and prevent defective chips or a degradation of accuracy of dicing caused by the generation of the transpired melt substance, and to provide a dicing method. <P>SOLUTION: The laser dicing apparatus 10 includes a laser optical section 40 wherein a laser light is given to a wafer W housed in a housing section 12. The apparatus includes a particle counter 50 for measuring cleanliness of the inside of the housing section 12, a suction FFU 54 for introducing a clean air into the housing section 12, and a discharge FFU 56 for discharging a gas inside the housing section 12. When the cleanliness inside the housing section 12 that is measured by the particle counter 50 becomes below a threshold, the suction FFU 54 and the discharge FFU 56 displace the gas contaminated by the transpired melt substance inside the housing section 12 with a clean gas according to instructions of a control section 60. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
