| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring substrate capable of preventing deformation such as a warpage or the like, or substantially reducing the amount of deformation; to provide its manufacturing method; and to prevent conveyance failure and mounting failure caused by deformation of the wiring substrate in an electronic mounting process. <P>SOLUTION: In the wiring board, one or more layers having a coefficient of thermal expansion different from that of a core layer are laminated on at least one surface side of the core layer, and a plurality of mounting regions to which a plurality of electronic components are mounted are formed on the surface layers of the laminated layers with prescribed spaces left between them. The core layer is divided for each mounting region or correspondingly to a group of the mounting regions covering a plurality of the mounting regions, and an insulating material forming the laminated layers is filled in a gap between the mutually adjoining core layers. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
