Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device

摘要

A substrate 10 for a semiconductor device includes: a base plate 1, a plurality of external terminal portions 12p, 12q, respectively arranged in a plane on the base plate 1 and having external terminal faces 12pb, 12qb respectively facing the base plate 1; a plurality of internal terminal portions 11, respectively arranged in the plane on the base plate 1 and having internal terminal faces 11a respectively facing an opposite side to the base plate 1. The internal terminal portions 11 are connected with the external terminal portions 12p, 12q, via wiring portions 17, respectively. A part of the external terminal portions 12p are located on the base plate 1 in a predetermined arrangement area A in which a semiconductor element 50 is arranged.