发明名称 |
Method for forming a back-to-back wafer batch to be positioned in a process boat and handling system for forming the back-to-back wafer batch |
摘要 |
<p>The method involves loading a packet-type back-to-back wafer batch into a process boot, where a number of wafers e.g. solar wafers, are provided in rows. Half of the number of wafers is transferred, in form of a wafer stack (9), from a transfer carrier (2) to a supplying position held outside the carrier. The other half of the number of wafers is moved, in form of a wafer stack (13), out of the carrier. The stack (13) is pivoted such that the wafers in the stack (13) pass into a position that is pivoted around 180 degrees relative to the position of the wafers in the stack (9). An independent claim is also included for a handling system for filling a process boot with a wafer batch.</p> |
申请公布号 |
EP1925577(B1) |
申请公布日期 |
2009.07.08 |
申请号 |
EP20060077093 |
申请日期 |
2006.11.24 |
申请人 |
JONAS & REDMANN AUTOMATIONSTECHNIK GMBH |
发明人 |
JONAS, STEFAN;REDMANN, LUTZ |
分类号 |
B65G49/06;H01L21/00;H01L21/677;H01L21/68;H01L21/683 |
主分类号 |
B65G49/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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