发明名称 CIRCUIT CONNECTION STRUCTURE
摘要 <p>A circuit connection structure capable of achieving an excellent electrical connection between opposed circuit electrodes and sufficiently enhancing the long-term reliability of the electrical characteristic between the circuit electrodes. A circuit connection structure (1) comprises a first circuit member (30) in which a first circuit electrode (32) is formed on a main surface (31a) of a first circuit board (31), a second circuit member (40) in which a second circuit electrode (42) is formed on a main surface (41a) of a second circuit board (41), and a circuit connection member (10) which contains an adhesive composition and conductive particles (12) and is provided between the main surface of the first circuit member (30) and the main surface of the second circuit member (40) so as to electrically connect the first and second circuit electrodes (32, 42). The first and second circuit electrodes (32, 42) have a thicknesses of 50 nm or more. A plurality of projections (14) are arranged on the surface side of the conductive particles (12). The outermost layer is formed by nickel or nickel alloy.</p>
申请公布号 KR20090075749(A) 申请公布日期 2009.07.08
申请号 KR20097011150 申请日期 2007.10.30
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 KOJIMA KAZUYOSHI;KOBAYASHI KOUJI;ARIFUKU MOTOHIRO;MOCHIZUKI NICHIOMI
分类号 H01L21/60;H05K1/14 主分类号 H01L21/60
代理机构 代理人
主权项
地址
您可能感兴趣的专利