RADIANT HEAT CIRCUIT BOARD OF NON-FLAT TYPE AND METHOD FOR MANUFACTURING OF RADIANT HEAT CIRCUIT BOARD OF NON-FLAT TYPE

摘要

A non-flat type heat discharging circuit board and a manufacturing method thereof are provided to prevent a crack of a printed circuit board by performing a softening process and a heat process before a bending process. An insulating layer or dielectric layer(20) is formed in an upper side of a metal plate(10). A first metal plate(30) is laminated on the upper side of the insulating layer or the dielectric layer. The first softening process is performed by applying the heat to the insulating layer or dielectric layer. The circuit pattern is formed on the first metal plate. A solder resist(40) is printed on the circuit pattern. The second softening process is performed by applying the heat of 120 to 250 degrees centigrade to the insulating layer or dielectric layer. The bending process of the printed circuit board is performed by using a hot press.