发明名称 CONTACT FORCE SENSOR PACKAGE, BLOOD PRESSURE MEASURING DEVICE WITH THE SAME, AND METHOD FOR FABRICATING THE CONTACT FORCE SENSOR PACKAGE
摘要 <p>A contact force sensor package, a blood pressure measuring unit including the same, and a method for manufacturing the contact force sensor package are provided to improve sensitivity by reducing a radial artery and a thin film when sensing a pulse. A vibration sensor and a first bonding pad(107) are arranged in an upper part of a substrate layer(102). A flexible printed circuit board layer(110) includes a second bonding pad(112). A second bonding pad is arranged in a place corresponding to the first bonding pad. The second bonding pad is electrically connected to the first bonding pad. One side of a vibration transmitting unit is in contact with the one side of the vibration sensor. The other side of the vibration transmitting unit is in contact with the human body. The vibration transmitting unit transmits the pulse to the vibration sensor. A junction layer(130A) is formed between the substrate layer and the flexible printed circuit board layer. The junction layer is not formed in a region overlapped with the vibration transmitting unit.</p>
申请公布号 KR20090075537(A) 申请公布日期 2009.07.08
申请号 KR20080001429 申请日期 2008.01.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JONG PAL
分类号 A61B5/02 主分类号 A61B5/02
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