METAL SUBSTRATE, METHOD OF MAKING THE SUBSTRATE, AND SMD TYPE LED PACKAGE USING THE SUBSTRATE

摘要

A metal substrate, a manufacturing method thereof, and a SMD(Surface Mount Device) type LED(Light Emitting Diode) package are provided to improve coupling force by forming an uneven region in a coupling region between first and second electrode plates and the insulation coupling element. A metal substrate(110) includes a first electrode plate(111), a second electrode plate(112) and an insulation coupling element(113). The insulation coupling element performs the electrical insulation and the physical coupling between the first electrode plate and the second electrode plate. An LED chip mounting space(114) is formed in an upper side of the first electrode plate or second electrode plate by half-etching. The depth of the LED chip mounting space is equal to or larger than the thickness of the LED chip. A circular hole is formed in the first electrode by etching. The circular hole is filled with the resin in order to improve the coupling force between the resin mold and the metal substrate.