MULTI-LAYERED COPPER FOIL AND MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD THEREOF

摘要

A multi layered copper foil and a printed circuit board using the same are provided to prevent a crack due to the heat by not processing a conductive through hole. A multi-layered copper foil is formed by laminating a first copper foil layer(18a), an etch stop layer(18b) and a second copper foil layer(18c) successively. The etch stop layer is made of the metal with a selective etch characteristic with regard to the first copper layer. A circuit pattern is formed on the multi layer copper foil using a dry film. The first copper foil circuit is formed by selectively etching the second copper foil layer until the etch stop layer is exposed. An insulating layer(20) is coated on the copper foil circuit. The second copper foil circuit is formed by selectively etching the first copper foil layer until the etch stop layer is exposed.