NOZZLE FOR HIGH-SPEED JETTING DEVICES

摘要

A nozzle for jetting devices is described comprising e.g. one patterned silicon substrate enabling semiconductor mass production. The method of manufacturing the nozzle is characterized by using one mask layer deposited on the silicon substrate. The etching of the silicon substrate is done by means of a first isotropic etching step and a second anisotropic etching step through the mask layer, resulting in a perfectly aligned nozzle.