| 摘要 |
<p>A stack package is provided to stack a BGA(ball grid array) package using a connecting terminal and a connecting substrate in order to reduce the size and height of the stack package. A stack package is comprised of at least two BGA packages(T,B) and a connecting substrate(120). The each BGA package is equipped with an electrode terminal, a first connecting terminal, a semiconductor chip and a second connecting terminal. The connecting substrate is interposed between the BGA packages. The connecting substrate is connected to the first connecting terminal of a top BGA package and the second connecting terminal of a bottom BGA package so as to electrically connect the top BGA package to the bottom BGA package.</p> |
