发明名称 Method of forming a layer of material using an atomic layer deposition process
摘要 Disclosed is a method of forming a layer of material using an atomic layer deposition (ALD) process in a process chamber of a process tool. In one illustrative embodiment, the method includes identifying a target characteristic for the layer of material, determining a precursor pulse time for introducing a precursor gas into the process chamber during the ALD process to produce the target characteristic in the layer of material, and performing the ALD process that comprises a plurality of steps wherein the precursor gas is introduced into the chamber for the determined precursor pulse time to thereby form the layer of material.
申请公布号 US7557047(B2) 申请公布日期 2009.07.07
申请号 US20060423197 申请日期 2006.06.09
申请人 MICRON TECHNOLOGY, INC. 发明人 RUEGER NEAL;SMYTHE JOHN
分类号 H01L21/31 主分类号 H01L21/31
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