发明名称 |
Au-sn alloy powder for solder paste |
摘要 |
The problem is to provide an Au-Sn alloy powder for use in producing an Au-Sn alloy solder paste having reduced generation of voids. The problem is solved by an Au-Sn alloy powder for a solder paste, which has a composition consisting of Sn of 20.5-23.5% by mass and a remainder containing Au and inevitable impurities, and which has a microstructure in which 0.5 to 30 area % of fine Sn-rich primary crystal phase regions having a diameter of 3 mum or less are crystallized in a matrix.
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申请公布号 |
US7556669(B2) |
申请公布日期 |
2009.07.07 |
申请号 |
US20060571289 |
申请日期 |
2006.12.26 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
ISHIKAWA MASAYUKI;KOHINATA MASAYOSHI;MISHIMA AKIHUMI |
分类号 |
B22F9/00 |
主分类号 |
B22F9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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