发明名称 Device for spreading viscous thermal medium on heat dissipation device for electronic component
摘要 A spreading device (10) includes an injector (14) and a spreading tube (16) connected with the injector. The injector contains therein a viscous thermal medium material for being spread on a surface of a cooling device for electronic components. The spreading tube defines therein at least one outlet hole (164) for release of the thermal medium material contained in the injector. The spreading device further includes means formed on the spreading tube for evenly distributing the material released through the outlet hole of the spreading tube over an entire area of the surface to be applied with the thermal medium material.
申请公布号 US7556689(B2) 申请公布日期 2009.07.07
申请号 US20060307544 申请日期 2006.02.13
申请人 FOXCONN TECHNOLOGY CO., LTD. 发明人 LEE CHIH-PENG;LIU TAY-JIAN
分类号 B05B1/16;B23K3/06 主分类号 B05B1/16
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