STACKED WAFER LEVEL PACKAGE

摘要

A stacked wafer level package is provided to reduce the volume, thickness and weight of a package by using a lower semiconductor chip as a semiconductor chip supporting substrate. A first semiconductor chip(110) has a first bonding pad. A second semiconductor chip(120) is arranged with the first semiconductor chip side by side. A second bonding pad of the second semiconductor chip is arranged in the same direction of the first bonding pad. A third semiconductor chip(130) is arranged on the first semiconductor chip and the second semiconductor chip. A third bonding pad of the third semiconductor chip is exposed between the first semiconductor chip and the second semiconductor chip. A wire structure(150) is electrically connected to the first bonding pad, the second bonding pad and the third bonding pad.