Polishing pad, use thereof and method for manufacturing the same

摘要

The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; and a buffer layer formed between the base material and an upper surface of the membrane with low permeability and embedded into the fibers of the base material. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided.