| 摘要 |
A MEMS (Microelectromechanical system) device is described. The device includes a first layer on a substrate, and a sacrificial layer on or over the first layer, the first sacrificial layer being configured to be removed in a removal procedure. The device also includes a second layer on or over the first sacrificial layer, where the second layer is spaced apart from the first layer, and a shorting element electrically connecting the first and second layers, where at least a portion of the shorting element is removable in the removal procedure.
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