SYSTEM FOR TREATMENTING SUBSTRATE

摘要

A substrate processing apparatus is provided to control the width of the end part of the substrate and reduce replacement time of equipment installation. The chamber(112) defines a reaction space. The substrate mounter(116) mounts a substrate(114) at the inside of the chamber. The main shielding member(118a) is installed on the top of the substrate mounter, and the first area corresponding to the central part of substrate is shielded. The peripheral shielding member(118b) shields the second area of the substrate, and rises and lowers the substrate. The several peripheral shielding members are formed.