发明名称 HEAT RADIATION TYPE LED PACKAGE
摘要 A heat radiation type led package is provided to prevent the degradation of the luminous efficiency and lifetime by using paraffin hydrocarbon group oil for efficiently radiating heat. The package body(10) comprises a chip mount area for a LED chip(2). The transparent shield(20) is formed in the package body in order to limit a cavity(121) near the LED chip. The transparent oil(30) of the paraffin hydrocarbon system is filled within the cavity. The package body comprises a lead frame(14), as a chip mount area and a housing(12) which limits the lower part of the cavity while supporting the lead frame. The transparent shield is made of a transparent resin or a glass in order to limit the top of cavity.
申请公布号 KR20090073600(A) 申请公布日期 2009.07.03
申请号 KR20070141579 申请日期 2007.12.31
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 KANG, SUK JIN;KIM, DO HYUNG
分类号 H01L33/64 主分类号 H01L33/64
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