| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wire bonding method capable of surely bonding a bonding wire to a part to be bonded when executing wire bonding using a bonding head utilizing ultrasonic waves. <P>SOLUTION: In the wire bonding method using the bonding head provided with a transducer for transmitting ultrasonic vibrations and a capillary 16 attached to the transducer, the bonding head is used which includes the capillary 16 for which a heater 18 is attached to the position of a node of vibrations generated when excited by the transducer, the capillary 16 is heated by the heater 18, and the wire bonding is executed. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
