| 摘要 |
PROBLEM TO BE SOLVED: To improve processing accuracy, to reduce processing time and to suppress the diffusion of solvent components inside and outside an apparatus by efficiently sticking solvent vapor to the surface of a resist pattern without using an ultraviolet irradiation process. SOLUTION: The surface of the resist pattern R formed on the surface of a semiconductor wafer W through an exposure process and a developing process is coated with water molecules m. The solvent vapor of a water-soluble solvent (such as NMP) is supplied to the surface of the resist pattern R coated with the water molecules m, and the surface of the resist pattern R is swollen by the solvent vapor combined with the water molecules m to achieve a smoothing process. The water molecules m and the solvent s stuck to the resist pattern R on the wafer W after the smoothing process are removed by drying. COPYRIGHT: (C)2009,JPO&INPIT |
