| 摘要 |
PROBLEM TO BE SOLVED: To accurately attach a circuit board to the front surface of a roller for an electronic device which is superior in position accuracy, without generating overlapping area, by minimizing gaps between circuit boards. SOLUTION: An apparatus includes a rotational mechanism (10) for holding a column-shaped or cylinder-shaped object (1), under the condition that the center axis be maintained in the horizontal state and making the object rotate about the center axis as the rotating axis; a holding mechanism (20) for holding a circuit board (2) under the condition that a bonding agent layer is directed downward and for transferring the circuit board (2) horizontally, and a controlling mechanism (30) for adjusting relative positional relation so that the bonding agent layer of the circuit board (2) transferred is placed, in contact with the front surface of the rotating object (1) and for controlling the pressure of the circuit board, pressing against the front surface of the object (1) to a constant value. COPYRIGHT: (C)2009,JPO&INPIT
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