| 摘要 |
A semiconductor device according to the present invention includes: an insulating substrate; a metal bonding member being disposed on the insulating substrate and having a porous region and a metal region, the porous region being provided with multiple pores therein and being adjacent to the metal region in a plane direction of the insulating substrate; a solder material impregnated into the pores; a semiconductor element disposed on the surface of the porous region in the metal bonding member; a bonding wire connected to the surface of the metal region in the metal bonding member. This makes it possible to provide a semiconductor device having improved electrical conductivity and thermal conductivity, and enabling the weight reduction.
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