发明名称 POLISHING PAD AND POLISHING METHOD
摘要 A polishing pad and a polishing method are described. The polishing pad is made from a composition compresing a polymeric matrix, an additive, and a rheology altering agent. The rheology altering agent enables a uniform distribution of the additive in the polymeric matrix.
申请公布号 US2009170409(A1) 申请公布日期 2009.07.02
申请号 US20080192350 申请日期 2008.08.15
申请人 IV TECHNOLOGIES CO., LTD. 发明人 WANG CHAO-CHIN;SHIH WEN-CHANG
分类号 B24B1/00;B24D11/00 主分类号 B24B1/00
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