| 摘要 |
A method for managing a manufacturing process of a semiconductor device using a backside scan device is provided to improve quality management and device management by displaying each unit process and chuck information on a window. A backside of a wafer is scanned by using a backside scan device(S120). The backside scan data, wafer chuck information, and wafer contact tool information are stored in a database(S130). A correlation is analyzed by receiving the backside scan data, the wafer chuck information, and the wafer contact tool information stored in the database(S140). Wafer information near to a scan map is displayed by using the result in which the correlation is analyzed(S150). A wafer chuck which causes a particle is searched by using the wafer backside scan map and the scan data obtained by the backside scan device(S170,S180).
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