| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a grinding device having a long-life dresser, and to provide a semiconductor device manufacturing method using the same. <P>SOLUTION: The grinding device comprises a grinding head and a retainer ring. The grinding head applies pressure onto the reverse side of a substrate to push the surface of the substrate against a pad to which slurry is supplied. The retainer ring has a dressing face DF for contacting the pad to which the slurry is supplied, to dress the pad. It also has a portion A1 formed of a first material and a portion A2 formed of a second material, on the dressing face side. The second material is easier to chip with the pad to which the slurry is supplied, than the first material. <P>COPYRIGHT: (C)2009,JPO&INPIT |
