| 摘要 |
PROBLEM TO BE SOLVED: To simplify a fixture constitution while eliminating the need for top-bottom inversion after a component setting in a fixture for component assembly is completed, when a semiconductor device is manufactured by setting a first solder, a semiconductor element, a second solder, and a second metal plate mounted in order on one surface of a first metal plate and making respective components to be bonded through solder reflow. SOLUTION: Hole parts 22 are provided at outer peripheral parts of mounting regions R1 and R2 of a semiconductor element 10 and the second metal plate 30 on one surface 21 of the first metal plate 20, and the fixture 200 is prepared which has a through-hole 201 and a projection part 202 projecting from the reverse surface such that a side surface of the projection part 202 and an inner wall of the through-hole 201 are on the same continuous plane. After the first metal plate 20 and fixture 200 are fixed by engaging the projection part 202 with the hole part 22, the first solder 40, semiconductor element 10, second solder 50, and second metal plate 30 are sequentially positioned by the inner wall of the through-hole 201 and mounted. COPYRIGHT: (C)2009,JPO&INPIT |
