| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate-treating device and a substrate treatment method capable of unifying treatment to a substrate to be treated and suppressing readhesion of a treatment liquid to a wafer and the disturbance of an air current near the edge of a wafer. SOLUTION: The substrate W to be treated supported by a support section 20 is rotated about an axis which extends substantially in a vertical direction as a center. Gas is injected downward toward the upper surface of the substrate W, to be treated on the support section 20 and is sucked upward from an upper region of the substrate W to be treated, thus pressing the substrate W to be treated on the support section 20 toward the support section 20. While the substrate W to be treated is being rotated and being pressed toward the support section 20, a treatment liquid, such as an etching liquid and a cleaning liquid, is supplied to the substrate W to be treated. COPYRIGHT: (C)2009,JPO&INPIT
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