| 摘要 |
A heat dissipation device (100) includes a base (300), a heat sink (200) and a heat pipe (400). The base (300) includes a bottom surface (320) for thermally contacting with a heat-generating component, a top surface (340) and two sloped side surfaces (360) spanning between the top surface (340) and the bottom surface (320). The heat sink (200) includes a plurality of fins perpendicularly attached on the sloped side surfaces (360) of the base (300) with a channel defined between the top surface (340) of the base (300) and the heat sink (200). The heat pipe (400) includes an evaporator (420) received in the channel defined by the top surface (340) of the base (300) and the heat sink (200) and a condenser (440) being inserted into the heat sink (200) above the evaporator (420).
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