| 发明名称 |
WHITE HEAT-CURABLE SILICONE RESIN COMPOSITION, OPTOELECTRONIC PART CASE, AND MOLDING METHOD |
| 摘要 |
A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130° C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed.
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| 申请公布号 |
US2009171013(A1) |
申请公布日期 |
2009.07.02 |
| 申请号 |
US20080344048 |
申请日期 |
2008.12.24 |
| 申请人 |
TAGUCHI YUSUKE;TOMIYOSHI KAZUTOSHI;TADA TOMOYOSHI;SHIMIZU HISASHI |
发明人 |
TAGUCHI YUSUKE;TOMIYOSHI KAZUTOSHI;TADA TOMOYOSHI;SHIMIZU HISASHI |
| 分类号 |
C08L83/06;B29D11/00;C08G77/14;C08K3/00;C08K3/20;H01L23/29;H01L23/31;H01L33/48;H01L33/50;H01L33/54;H01L33/56;H01L33/60;H01L33/62 |
主分类号 |
C08L83/06 |
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