发明名称 LED PACKAGE FOR BACKLIGHT
摘要 <p>An LED package used as a light source of a backlight and formed in a step type structure with a lens is provide to improve light efficiency and enlarge a light advancing angle range. The light emitting diode package includes a substrate, a sidewall formed on the substrate and defining a space, and at least one light emitting diode chip mounted on the substrate in the space. An inner surface of the sidewall is formed in an oblique side step type structure that can reflect light, which may disappear in the space, among light emitted from the light emitting diode chip. A lens for widely emitting the light emitted from the light emitting diode chip and the reflected light upward is attached on a top of the sidewall to enclose the space in which the light emitting diode chip is mounted. According to the LED package for the backlight unit of the present invention, since the inner surface of the sidewall is formed in an oblique side step type structure and the lens that can widely emit the light is provided, the light loss in the LED package is reduced to improve the light efficiency and the advancing angle by the oblique side of the sidewall improves the uniformity of the light in the vertical direction. In addition, the light can be uniformly advanced in all directions by the lens.</p>
申请公布号 WO2009082079(A1) 申请公布日期 2009.07.02
申请号 WO2008KR04780 申请日期 2008.08.18
申请人 HEESUNG ELECTRONICS CO., LTD.;LEE, JUNG-GEE 发明人 LEE, JUNG-GEE
分类号 G02F1/13357 主分类号 G02F1/13357
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