| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a scheduling method for a substrate treating apparatus that can avoid an extended scheduling time and improve an operating rate. <P>SOLUTION: Schedules are prepared before execution of treatment, so that a later operation of a preceding treating step and an early operation of a succeeding treating step can be overlapped and arranged. The treating step of a lot whose preceding treating step completes early is selected and allocated with priority as the next treating step, whereby the time until completion of the next treating step can be shortened. Further, the treating step of the same lot as a lot allocated earlier is allocated with priority (step W7, W11), whereby scheduling time can be shortened about a schedule where a step is resumed from a state in which an apparatus is stopped. As a result, an extended scheduling time can be avoided and a wasteful standby time can be prevented from arising to improve the operating rate. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
