发明名称 ALIGNMENT METHOD OF CONNECTION ELEMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of arranging a plurality of connection elements that come into contact with respective electrode pads of a plurality of spatially separated electronic components and produce physically uniform results. <P>SOLUTION: The method of arranging the plurality of connection elements for simultaneously coming into contact with the plurality of electronic components on an electronic substrate includes a step of manufacturing each connection element whose one end has a first extension region extending in a certain direction and having a certain width and the other end has a second extension region extending in a certain direction and having a certain width, a step of binding the first extension region of each connection element to a fixed post formed in a predetermined region of the electronic substrate so that the second extension regions of respective connection elements are in parallel with each other. The extension lengths of respective second extension regions are the same. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009145315(A) 申请公布日期 2009.07.02
申请号 JP20080097334 申请日期 2008.04.03
申请人 PHICOM CORP 发明人 LEE OUG KI
分类号 G01R1/073;H01L21/66 主分类号 G01R1/073
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