| 摘要 |
PROBLEM TO BE SOLVED: To provide a deposition type copper alloy material for electronic equipment which does not cause abnormal deposition of a plated layer as well as deterioration of oxide film adhesiveness, and also to provide a method for production of such a copper alloy material. SOLUTION: A deposition type copper alloy includes, by mass, 2.0-4.0% Ni, 0.4-0.8% Si, 0.005-2.0% in the sum of at least one of 0.005-0.2% Ag, 0.005-0.2% Mn and 0.05-1.0% Zn, the balance Cu with inevitable impurities, and has a work-affected layer on the surface thereof. The deposition type copper alloy material for electronic equipment is produced by heat-treating the above copper alloy at 500-600°C in a non-oxidizing or reducing atmosphere to regulate the thickness of the work-affected layer to be≤0.2μm (excluding zero), and by applying a silver or copper plating on the copper alloy. COPYRIGHT: (C)2009,JPO&INPIT |
